90 nm Process Technology Enables Smaller Die Size, Easier Implementation in Multi-Chip-Package and System-in-Package Designs
Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it has started shipping samples of small form-factor, 512 Megabit Mobile RAM devices for high-performance, 3G cellular applications. By utilizing 90 nm process technology, Elpida can now offer customers 512 Megabit Mobile RAM devices with a smaller and square die for easier implementation into Multi-Chip Package (MCP) and System-in-Package (SiP) designs which require 11 x 11 mm packages or smaller to save valuable board space.
"As feature-rich cellular phones become more mainstream, the demand for high-density Mobile RAM is steadily increasing," said Akira Yabu, manager of Technical Marketing at Elpida Memory (USA). "Elpida's 512 Megabit devices with 90 nm design geometry are ideal for supporting handset systems with real-time operating systems such as Linux, Symbian or Windows CE that require high-density memory, but have limited space."
Elpida's 512 Megabit Mobile RAM - Technical Details
Elpida's 512 Megabit Mobile RAM devices (Part numbers: ECK5416CBC1, ECK5132CBCN, ECK5432CBC1, ECL5416CBC1, ECL5432CBC1) are organized as 16M words x 32-bits or 32M words x 16-bits, respectively, and they are available in either SDR or DDR architectures depending on application performance requirements.
Elpida plans to expand its 90 nm line up by adding 128 Megabit and 256 Megabit Mobile RAM products later this year. Elpida also offers volume production on a variety of 90 nm DDR2 SDRAM products for the server market.
Elpida's 512 Megabit Mobile RAM devices are currently sampling to customers. Volume production is planned for the 3rd quarter of 2005.
Explore further: Big data paves the way for big building and engineering projects