(PhysOrg.com) -- Controlling power consumption in mobile devices and large scale data centers is a pressing concern for the computer chip industry. Researchers from Penn State and epitaxial wafer maker IQE have created a ...
Electronics & Semiconductors
Dec 12, 2011
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Elpida Memory, the third largest Dynamic Random Access Memory (DRAM) manufacturer in the world, today announced that it had developed the industry's first 4-gigabit next-generation mobile memory chips for smart phones, tablet ...
Electronics & Semiconductors
Nov 18, 2011
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South Korea's top mobile carrier SK Telecom said Monday it signed a deal to buy a controlling stake in Hynix Semiconductor, the world's number two memory chip maker.
Business
Nov 14, 2011
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South Korea's top mobile carrier SK Telecom has been selected as preferred bidder for a controlling stake in Hynix Semiconductor, the world's number two memory chip maker, creditors said Friday.
Business
Nov 11, 2011
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South Korea's top mobile carrier SK Telecom has submitted a final bid to buy a controlling stake in Hynix Semiconductor, the world's second-largest memory chip maker, a report said Thursday.
Business
Nov 10, 2011
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Hewlett Packard (HP) sees a future in super-efficient data centers powered by the kinds of power-sipping computer chips used in smartphones and tablet computers.
Hardware
Nov 3, 2011
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South Korea's Samsung Electronics will file lawsuits to try to block the sale of Apple's iPhone 5 as part of its global legal tussle with the US technology giant, a report said Tuesday.
Business
Sep 20, 2011
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Wireless devices such as mobile phones rely on the radio spectrum to send and receive data. There is growing interest in using a worldwide unlicensed spectrum around 60 gigahertz for future wireless applications, but conventional ...
Telecom
Sep 19, 2011
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A University of California, San Diego technology that significantly reduces the amount of energy wasted by chips in computers, mobile phones and other electronic devices has recently passed the trillion watt-hour milestone ...
Electronics & Semiconductors
Sep 7, 2011
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Imec and its 3D integration partners have proven the potential of 3D integration of a commercial DRAM chip on top of a logic IC for next-generation low-power mobile applications. Imec’s applied 3D EDA (electronic design ...
Electronics & Semiconductors
Jul 12, 2011
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