Carbon nanotubes best for 3D electronics

(PhysOrg.com) -- Researchers at Chalmers have demonstrated that two stacked chips can be vertically interconnected with carbon nanotube vias through the chips. This new method improves possibilities for 3D integration of ...

Small wires make big connections for microelectronics

University of Illinois engineers have developed a novel direct-writing method for manufacturing metal interconnects that could shrink integrated circuits and expand microelectronics.

Back to the future for computers: A return to the 1980s?

A presentation at the Optical Fiber Communication Conference and Exposition/National Fiber Optic Engineers Conference (OFC/NFOEC) in San Diego on March 24 will examine the technologies that will emerge in the next three to ...

New model suggests how the brain might stay in balance

(PhysOrg.com) -- Physicists have theorized for decades about how neural networks might be able to accomplish the incredibly complex calculations the human brain performs all the time. But simply stabilizing such a powerful ...

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