Device bonds metal and plastic within seconds

Scientists at the Fraunhofer Institute for Material and Beam Technology IWS in Dresden have developed a joining gun that creates a connection between metal and thermoplastic materials within seconds. This gun is of a modular ...

Qualcomm settles vastly reduced Taiwan antitrust fine

US chipmaking giant Qualcomm on Friday agreed a sharply reduced fine with Taiwan after officials said it had harmed market competition and manipulated prices, as it faces a number of probes worldwide.

From the quantum level to the car battery

New developments require new materials. Until recently, these have been developed mostly by tedious experiments in the laboratory. Researchers at the Fraunhofer Institute for Algorithms and Scientific Computing SCAI in Sankt ...

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