Technique streamlines fabrication of 2-D circuits

Exotic 2-D materials hold great promise for creating atom-thin circuits that could power flexible electronics, optoelectronics, and other next-generation devices. But fabricating complex 2-D circuits requires multiple time-consuming, ...

Enabling fabrication beyond 7nm

How did we get from the Palm Pilots of the 90s to the ultra-powerful smart phones of today? In large part, because of scaling, where integrated circuits are made with smaller feature sizes fitting more and more circuit elements ...

Lighting the way to switch chemical reaction pathways

Could the manufacture of the integrated circuits and chips for our everyday electronic devices be made simpler, safer and cheaper simply by being able to switch coloured light on and off?

Engaging diamond for next-era transistors

As consumers around the world have become increasingly dependent on electronics, the transistor, a semiconductor component central to the operation of these devices, has become a critical subject of scientific research. Over ...

Novel technique measures warpage in next-gen integrated circuits

As integrated circuit components are coming up against size limits, manufacturers are turning to new approaches based on stacking extremely thin wafers. However, the thin wafers easily warp under the stresses involved in ...

Printable holograms could make holograms more widespread

(Phys.org)—Holograms have a wide variety of applications, from 3D displays to data storage, but the potential applications are currently limited by the complexity and cost of hologram fabrication. In an attempt to simplify ...

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