Taking microelectronics to a new dimension

Metallic microstructures are the key components in almost every current or emerging technology. For example, with the next wireless communication standard (6G) being established, the need for advanced components and especially ...

Two-photon polymerization of PEGda hydrogel microstructure

The fabrication of shape-memory hydrogel scaffolds not only requires biocompatibility, micrometer resolution, high mechanical strength, but also requires a low polymerisation threshold in high-water content environment to ...

Semi-random scattering of light

What is the exact path of light inside a highly scattering material like white paint? This is a question that is impossible to answer, as the particles inside the paint are distributed randomly. This, at the same time, is ...

Team designs carbon nanostructure stronger than diamonds

Researchers at the University of California, Irvine and other institutions have architecturally designed plate-nanolattices—nanometer-sized carbon structures—that are stronger than diamonds as a ratio of strength to density.

New record: 3-D-printed optical-electronic integration

Optoelectronic integration offers a promising strategy to simultaneously obtain the merits of electrons and photons when they serve as information carriers, including high-density communication and high-speed information ...

Invisible, stretchable circuits to shape next-gen tech

Electrically conductive films that are optically transparent have a central role in a wide range of electronics applications, from touch screens and video displays to photovoltaics. These conductors function as invisible ...

Erasable ink for 3-D printing

3-D printing by direct laser writing produces micrometer-sized structures with precisely defined properties. Researchers of Karlsruhe Institute of Technology (KIT) have now developed a method to erase the ink used for 3-D ...

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