Researchers from Universidad Carlos III de Madrid and the Universidad de Málaga have collaborated with the consulting and technology company Indra on the development of a new advanced simulator of training in cybersecurity, ...
Security
Dec 12, 2014
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The Department of Defense wants to give airmen and soldiers an advantage in combat by integrating technology with lightweight wearable equipment.
Hi Tech & Innovation
Nov 12, 2014
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United Technologies Corp. canceled a planned furlough of 2,000 workers after the Department of Defense recalled most of its civilian employees.
Business
Oct 7, 2013
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(Phys.org) —Significant proof of the critical importance of long term basic research funding has been demonstrated with the first convincing operation of a room temperature, continuous wave nanolaser powered by electricity.
Electronics & Semiconductors
Jul 16, 2013
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The Humanoid Robot Research Center (HUBO Lab) at the Korea Advanced Institute of Science and Technology (KAIST) and Rainbow Co., a spin-off venture company of the university, unveiled a new model of HUBO that will be entered ...
Robotics
Jul 11, 2013
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A Chinese supercomputer is the fastest in the world, according to survey results announced Monday, comfortably overtaking a US machine which now ranks second.
Hardware
Jun 17, 2013
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(Phys.org) —How is this for bragging rights in the always-on title grab for the world's fastest supercomputer: China's Tianhe-2 supercomputer, aka Milkyway-2, recently measured at speeds of 31 petaflops (30.65) out of a ...
(Phys.org) —Motorola's CEO Dennis Woodside along with the company's senior vice present for advanced technology took to the All Things Digital stage this week to reveal what they think about the future of passwords—namely, ...
(Phys.org) —Arizona State University computer scientist Gail-Joon Ahn has been granted a U.S. patent for a novel identity management system that helps protect personal identity information stored on digital devices.
Software
May 21, 2013
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Researchers from the Georgia Institute of Technology have won a Defense Advanced Research Projects Agency (DARPA) contract to develop three-dimensional chip-cooling technology able to handle heat loads as much as ten times ...
Engineering
Apr 2, 2013
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