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                    <title>Renesas Electronics in the news</title>
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            <description>Latest news from Renesas Electronics</description>

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                    <title>Renesas announces SRAM using leading-edge 16 nm FinFET for automotive information systems</title>
                    <description>Renesas Electronics today announced the development of a new circuit technology for automotive information SoCs (system on chips) at 16 nanometer (nm) and beyond. Using this new circuit technology, Renesas tested the prototype of an SRAM, at the 16 nm node as the cache memory for CPU and real-time image processing blocks in an SoC, and successfully confirmed that this SRAM operates at the high speed of 641 ps under the low-voltage condition of 0.7 V.</description>
                    <link>https://phys.org/news/2014-12-renesas-sram-leading-edge-nm-finfet.html</link>
                    <category>Electronics &amp; Semiconductors</category>                    <pubDate>Fri, 19 Dec 2014 08:30:02 EST</pubDate>
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                    <title>28nm process technology achieves increased capacities in on-chip flash memory in microcontrollers</title>
                    <description>Renesas Electronics Corporation today announced that it has developed the industry&#039;s first 28-nanometer (nm) flash memory intellectual property (IP) for microcontrollers (MCUs) using a 28 nm process technology.</description>
                    <link>https://phys.org/news/2014-02-28nm-technology-capacities-on-chip-memory.html</link>
                    <category>Electronics &amp; Semiconductors</category>                    <pubDate>Wed, 19 Feb 2014 08:27:45 EST</pubDate>
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                    <title>Low-power microcontroller family with up to 1MB of on-chip flash unveiled</title>
                    <description>Renesas Electronics today announced the availability of a large number of new low-power, low voltage microcontrollers (MCUs). By expanding the low-power, low-voltage RX200 Series to include versions offering from 64 KB to 1 MB of on-chip flash memory, and package sizes from 48-pin LQFP to 145-pin LGA, Renesas now offers the broadest range of low-power 32-bit solutions in the industry. Combined with active mode power consumption of 7.2 mA at 50 MHz operation and a standby mode of 0.4 µA, the RX200 series is positioned to become the de-facto choice of designers looking for the lowest power and highest performance in a 32-bit MCU.</description>
                    <link>https://phys.org/news/2013-03-low-power-microcontroller-family-1mb-on-chip.html</link>
                    <category>Electronics &amp; Semiconductors</category>                    <pubDate>Thu, 07 Mar 2013 10:52:15 EST</pubDate>
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                    <title>Second-generation USB 3.0-SATA3 bridge SoC with reduced external components</title>
                    <description>Renesas Electronics today announced the availability of its new SuperSpeed Universal Serial Bus (USB 3.0) to Serial ATA (SATA) Revision 3 [Note] bridge SoC (system on chip, part number µPD720231) that enables the reduction of the total BOM significantly. The uPD720231 enables effective multi-gigabit per second (Gbps) data transfer between a USB 3.0 host system and a SATA device used in widely adopted external USB hard drives and solid state drives (SSD).</description>
                    <link>https://phys.org/news/2013-03-second-generation-usb-sata3-bridge-soc.html</link>
                    <category>Hardware</category>                    <pubDate>Wed, 06 Mar 2013 08:31:05 EST</pubDate>
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                    <title>Low-power industrial ethernet communication chips with integrated real-time OS offload engine</title>
                    <description>Renesas Electronics today announced the R-IN32M3 series of industrial Ethernet communication chips with support for multiple communication protocols in response to the rapid adoption of industrial Ethernet communication technology.</description>
                    <link>https://phys.org/news/2012-11-low-power-industrial-ethernet-chips-real-time.html</link>
                    <category>Electronics &amp; Semiconductors</category>                    <pubDate>Tue, 27 Nov 2012 07:21:31 EST</pubDate>
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