Imec boosts performance of beyond-silicon devices

At this week's IEEE IEDM conference, nano-electronics research center imec demonstrates record enhancement of novel InGaAs Gate-All-Around (GAA) channel devices integrated on 300mm Silicon and explores emerging tunnel devices ...

Imec advances drive current in vertical 3D NAND memory devices

At this week's IEEE IEDM conference, nano-electronics research center imec showed for the first time the integration of high mobility InGaAs as a channel material for 3D vertical NAND memory devices formed in the plug (holes) ...

Versatile single-chip sensor for ion detection in fluids

Imec and Holst Centre (set-up by imec and TNO) have demonstrated a prototype of a single-chip electrochemical sensor for simultaneous detection of multiple ions in fluids. The demonstrator paves the way to small-sized and ...

Thermoplastically deformable electronic circuits

At this week's Meeting of the International Microelectronics Assembly and Packaging Society (IMAPS 2015), imec and CMST (imec's associated lab at Ghent University) present a novel technology for thermoplastically deformable ...

Turning clothing into information displays

Researchers from Holst Centre (set up by TNO and imec), imec and CMST, imec's associated lab at Ghent University, have demonstrated the world's first stretchable and conformable thin-film transistor (TFT) driven LED display ...

High-accuracy narrow-pitch bonding of 3D ICs using thermocompression

Today, at SEMICON WEST 2015 (San Francisco), world-leading nano-electronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries announced that they have jointly developed ...

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