ASUS Unveils First Motherboards to Feature USB 3.0 and SATA 6Gb/s Performance
ASUS today announced a range of enhanced motherboard solutions that deliver true USB 3.0 and SATA 6Gb/s data throughput performance.
The ASUS Xtreme Design P7P55D-E Series motherboard has onboard support while the ASUS Xtreme Design P7P55D Series utilizes the ASUS U3S6 PCIe x4 expansion card to deliver the latest USB and SATA data transfer capabilities. Equipped with the Intel P55 Express chipset, the P7P55D-E / P7P55D Series supports the latest LGA 1156 socket for Intel Core i7/Core i5 Processors.
Additionally, they also feature exclusive Hybrid Technology -- Hybrid Processor, Hybrid Phase, and Hybrid OS -- to give users intelligent performance enhancement, active cooling, and rapid online access.
ASUS’ expansion bridge design fully unleashes USB 3.0 and SATA 6Gb/s transfer rates for both the P7P55D-E Series and the U3S6 expansion card. This specially-designed onboard IC doubles the bandwidth of the PCIe interface from Gen 1 to Gen 2, delivering ten times faster USB 3.0 throughput compared to the previous USB 2.0 standard. Additionally, by eliminating transmission bottlenecks, the expansion bridge increases hard disk read and write speeds by up to 50%. Transferring a 20GB HD movie now takes less than 70 seconds, while a 4MB song requires less than 0.01sec.
Similarly, by inserting the ASUS U3S6 PCIe x4 expansion card into P7P55D Series motherboards, users can achieve the same rapid throughput with the latest USB 3.0 devices and SATA hard disks.
The ASUS P7P55D-E/P7P55D Series includes new Xtreme Design innovations—Hybrid Processors, Hybrid Phase Technology and Hybrid OS for optimized performance and enhanced stability. Hybrid Processors enable intuitive, real-time overclocking and automatic performance tuning for users to gain the processing power and speeds associated with a higher-end CPU. For enhanced stability, the P7P55D-E and P7P55D Series include the world’s leading Hybrid Phase power feature, which combines multi-phase power delivery with real-time phase balancing to improve cooling of active components.