Chipmaker Renesas Technology will develop a next-generation large-scale integration circuit, a Japanese daily reported Monday.

The Nihon Keizai Shimbun said that the semiconductor manufacturer will collaborate with NTT DoCoMo, Fujitsu, Mitsubishi Electrics and Sharp among others to develop LSIs for third-generation phones.

The plan is to have the product ready for use by the autumn of 2007.

Copyright 2006 by United Press International