News tagged with wafer dicing
Ultrathin light-emitting diodes create new classes of lighting and display systems
(PhysOrg.com) -- A new process for creating ultrathin, ultrasmall inorganic light-emitting diodes (LEDs) and assembling them into large arrays offers new classes of lighting and display systems with interesting ...
Aug 20, 2009 |
4.8 / 5 (11) |
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Search results for wafer dicing
Apple has solar designs, wins patents
(PhysOrg.com) -- Apple recently won patents with the US Patent and Trademark office. These patents focus on ideas for using solar technology for laptops, smartphones and tablets. One such patent involves using ...
Technology / Hi Tech & Innovation
Oct 23, 2011 |
2.4 / 5 (11) |
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Silicon technology offers extended X-ray vision of high-energy cosmos
(PhysOrg.com) -- As elements of the integrated circuits running our computers, phones and electronics, silicon wafers are everywhere. An ESA-led effort is establishing an out-of-this-world use for these ...
Space & Earth / Space Exploration
Dec 21, 2009 |
5 / 5 (3) |
2
Micromachined piezoelectric harvester drives fully autonomous wireless sensor
For the first time, a piezoelectric harvesting device fabricated by MEMS technology generates a record of 85μW electrical power from vibrations. A wafer level packaging method was developed for robustness. ...
Dec 15, 2009 |
5 / 5 (11) |
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Low Temperature Laser Processing Solves a Problem in Smart Materials Manufacturing
(PhysOrg.com) -- If researchers could integrate some of the active materials, such as perovskites, that have been developed in recent years for microsensor, actuator, and transducer applications directly onto ...
Dec 18, 2008 |
4 / 5 (2) |
0
Fujitsu Pioneers Use of Carbon Nanotubes for Heatsinks for Semiconductors
Fujitsu today announced that they have succeeded in the world's first development of carbon nanotube-based heatsinks for semiconductor chips. The use of carbon nanotubes as heatsinks for high-frequency high ...
Dec 05, 2005 |
3.9 / 5 (8) |
0
FlipChip, NEC sign cross-license agreement for advanced wafer level packaging technology
FlipChip International and NEC Electronics today announced that the two companies have entered into an extensive patent cross-licensing agreement for advanced wafer level packaging, flip chip bumping, solder bump reinforcement ...
Apr 21, 2005 |
2 / 5 (1) |
0
Infineon Expands in Portugal - Memory Chip Assembly and Testing Facility Enlarged at Cost of Euro 230 Million
Munich/Germany and Porto/Portugal – June 15, 2004 – Infineon Technologies AG, one of the world’s leading semiconductor manufacturers, today announced that it is expanding its existing memory chip assembly and test (backend) ...
Jun 15, 2004 |
1 / 5 (1) |
0
List of search results for wafer dicing
