News tagged with package technology
Magnetic actuation enables nanoscale thermal analysis
Polymer nano-films and nano-composites are used in a wide variety of applications from food packaging to sports equipment to automotive and aerospace applications. Thermal analysis is routinely used to analyze ...
Jan 12, 2012 |
5 / 5 (1) |
0
|
CNSE develops innovative laser-enabled electronic packaging technology
(PhysOrg.com) -- Small. Fast. Precise. A new electronics manufacturing technology developed at NDSU’s Center for Nanoscale Science and Engineering eliminates challenges facing conventional packaging techniques and shows ...
Nov 18, 2011 |
5 / 5 (2) |
0
Samsung develops 30nm-class 32GB green DDR3 for next-generation servers
Samsung Electronics today announced the development of 32 gigabyte (GB) double data rate-3 (DDR3) registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) through silicon via (TSV) package technology.
Aug 18, 2011 |
4.5 / 5 (2) |
1
Elpida begins sample shipments of DDR3 SDRAM (x32) based on TSV stacking technology
Elpida Memory today announced that it has begun sample shipments of the industry's first DDR3 SDRAM (x32-bit I/O configuration) made using TSV (Through Silicon Via) stacking technology. The sample is a low-power 8-gigabit ...
Jun 28, 2011 |
not rated yet |
0
iNAND embedded flash drives enable continued development of powerful mobile devices
SanDisk Corporation, the global leader in flash memory cards, today announced its next generation of iNAND and iNAND Ultra embedded flash drives featuring smaller and thinner form factors. Available in packages ...
Feb 14, 2011 |
not rated yet |
0
Adobe posts higher 2Q profit as revenue soars
(AP) -- Software maker Adobe Systems Inc. posted higher net income for its most recent quarter, driven by strong demand for the software package it sells to professional designers and developers.
Jun 22, 2010 |
not rated yet |
0
Samsung Develops Advanced Packaging Technology to Achieve a 0.6mm-thick 8-chip Package
Samsung Electronics announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory ...
Nov 05, 2009 |
5 / 5 (2) |
0
Funding A Greener Grid: How Obama plans to spend billions on modernizing the U.S. electrical network
President Barack Obama announced on Tuesday that his administration plans to spend $3.4 billion on producing a safer, more efficient electrical grid. Obama underscored the need to find clean forms of energ ...
Technology / Energy & Green Tech
Oct 29, 2009 |
not rated yet |
1
Elpida Completes Development of Cu-TSV (Through Silicon Via) Multi-Layer 8-Gigabit DRAM
Elpida Memory today announced that it has completed development of a Cu-TSV (Through Silicon Via) multi-layer 8-Gigabit DRAM.
Aug 31, 2009 |
4 / 5 (5) |
0
Tessera wins patent dispute with chipmakers
(AP) -- Tessera Technologies Inc. said Wednesday that it won a patent dispute over small-format semiconductor packaging products, with the International Trade Commission issuing a cease-and-desist order against rivals Motorola ...
May 21, 2009 |
not rated yet |
0
Study outlines how to succeed with refillable packaging
Reusable and recyclable packaging are shooting up the news, public, and political agenda, and increasingly can offer a cutting edge to the growing number of environmentally-conscious consumers. But what makes a refillable ...
May 13, 2009 |
not rated yet |
0
Barack Obama Announces Another $1.2 billion for Energy R&D
(PhysOrg.com) -- One of the more interesting areas of technological development in the coming years is likely to be energy development -- specifically green energy development. With new advances in physics ...
Technology / Energy & Green Tech
Mar 24, 2009 |
4.8 / 5 (16) |
3
NEC Develops a Three-Dimensional Chip-Stacked Flexible Memory
NEC Corporation announced today the development of chip-stacked flexible memory, which can be used to achieve a new system-on-chip (SoC) architecture. The new SoC's architecture consists of separate logic ...
Feb 10, 2009 |
2.3 / 5 (3) |
0
Unprecedented growth seen for solar energy
The head of the federal government's effort to promote solar technology told about 200 industry leaders yesterday that expanding the industry to the level needed by 2030 will require unprecedented levels of growth.
Technology / Energy & Green Tech
Feb 06, 2009 |
4.2 / 5 (9) |
9
- Pages: 1
