Skyscraper-style chip design boosts performance 1,000-fold

For decades, engineers have designed computer systems with processors and memory chips laid out like single-story structures in a suburb. Wires connect these chips like streets, carrying digital traffic between the processors ...

Imec advances drive current in vertical 3D NAND memory devices

At this week's IEEE IEDM conference, nano-electronics research center imec showed for the first time the integration of high mobility InGaAs as a channel material for 3D vertical NAND memory devices formed in the plug (holes) ...

4-D technology allows self-folding of complex objects

Using components made from smart shape-memory materials with slightly different responses to heat, researchers have demonstrated a four-dimensional printing technology that allowed creation of complex self-folding structures.

Global quantum communications—no longer the stuff of fiction?

Neither quantum computers nor quantum cryptography will become prevalent technologies without memory systems able to manipulate quantum information easily and effectively. The Faculty of Physics at the University of Warsaw ...

Rice's silicon oxide memories catch manufacturers' eye

(Phys.org) —Rice University's breakthrough silicon oxide technology for high-density, next-generation computer memory is one step closer to mass production, thanks to a refinement that will allow manufacturers to fabricate ...

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