(Phys.org)—Taiwan-based Macronix has found a solution for a weakness in flash memory fadeout. A limitation of flash memory is simply that eventually it cannot be used; the more cells in the memory chips are erased, the ...
(Phys.org)—Nanoparticles are versatile harbingers of hope: They can serve as active medical agents or contrast media just as well as electronic storage media or reinforcement for structural materials. Researchers from the ...
Nanomaterials
Feb 25, 2013
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Though smartphones and tablets are hailed as the hardware of the future, their present-day incarnations have some flaws. Most notoriously, low RAM memory limits the number of applications that can be run at one time and quickly ...
Nanophysics
Jul 16, 2012
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The electronics industry has a remarkable impact on the environment, yet research is devising new solutions to reduce it. Among these, a new compound with an unutterable name, the diisopropylammonium bromide (DIPAB), a new ...
Materials Science
Jan 28, 2013
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Toshiba Corporation today announced that the company has developed a prototype memory element for a spin transfer torque magnetoresistive random access memory (STT-MRAM) that achieves the world's lowest power consumption ...
Electronics & Semiconductors
Dec 13, 2012
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Samsung Electronics announced today that it has now begun volume production of an ultra-fast embedded memory for smartphones, tablets and other mobile devices in 16-, 32- and 64-gigabyte (GB) densities.
Hardware
Aug 2, 2012
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Elpida Memory today announced it had completed development of the industry's first 25-nanometer (nm) process 4-gigabit DDR3 SDRAM. The new chip is also the smallest 4-gigabit DRAM. The new cutting-edge smallest available ...
Electronics & Semiconductors
Sep 23, 2011
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Samsung Electronics announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory package is just ...
Electronics & Semiconductors
Nov 5, 2009
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Samsung Electronics announced today that it is mass producing the world's fastest embedded memory – the industry's first eMMC 5.0 devices – in 16 gigabyte (GB), 32GB and 64GB densities for next-generation smartphones ...
Hardware
Jul 30, 2013
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Fujitsu Semiconductor today announced the addition of new small package to the MB85RC16, the 16kbit ultra low-power Ferroelectric Random Access Memory (FRAM) device with an I2C interface.
Electronics & Semiconductors
Nov 27, 2012
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