News tagged with memory modules
Toshiba Launches Highest Density Embedded NAND Flash Memory Modules
Toshiba Corporation today announced the launch of a 64 gigabyte (GB) embedded NAND flash memory module, the highest capacity yet achieved in the industry.
Dec 15, 2009 |
4.9 / 5 (10) |
1
To DDR3: Thanks for the memory but time for DDR4
(Phys.org) -- Micron Technology is polishing up its DDR4 memory modules, “sampling” the modules and getting feedback from major customers. The company plans to reach volume production later this year ...
May 10, 2012 |
3.5 / 5 (10) |
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ASUS Unveils First TUF Series Motherboard
ASUS today unveiled the first motherboard in its newly-developed "TUF" (The Ultimate Force) Series, the SABERTOOTH 55i.
Sep 29, 2009 |
3.4 / 5 (8) |
2
Samsung Expands Green Line-up with 40nm-class 4Gigabit DDR3
Samsung Electronics announced today that it has begun mass producing the industry’s first low-power (green) four gigabit (Gb) DDR3 devices using 40 nanometer (nm) class process technology. The high-density ...
Feb 24, 2010 |
4.4 / 5 (5) |
1
Samsung Ships 40nm-class, 32-Gigabyte Memory Module for Server Applications
Samsung Electronics announced today that it has begun shipping samples of the industry’s highest-density memory module for server systems. The 32 gigabyte (GB) module has been designed for ...
Mar 29, 2010 |
4.8 / 5 (4) |
0
Samsung Announces First Validated 40-nanometer Class DRAM
Samsung Electronics announced today that it has developed and validated the first 40-nanometer (nm) class DRAM chip and module. This new 1-Gigabit DDR2 component (x8) and a corresponding 1-Gigabyte 800Mbps ...
Feb 05, 2009 |
5 / 5 (3) |
0
Sample shipments of 30nm process 4-Gigabyte DDR3 SO-DIMM out by Elpida
Elpida Memory, Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced it has begun sample shipments of its newly developed 30nm process 4-gigabyte DDR3 SO-DIMM. The new memory module was built ...
Dec 21, 2010 |
5 / 5 (2) |
1
Samsung develops 30nm-class 32GB green DDR3 for next-generation servers
Samsung Electronics today announced the development of 32 gigabyte (GB) double data rate-3 (DDR3) registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) through silicon via (TSV) package technology.
Aug 18, 2011 |
4.5 / 5 (2) |
1
Samsung Develops World's Highest Density DRAM Chip (Low-power 4Gb DDR3)
Samsung Electronics announced today that it has made a significant advancement in the push for higher volume memory chips by developing the world’s first four gigabit (Gb) DDR3 DRAM chip, using 50 nanometer process technology.
Jan 30, 2009 |
5 / 5 (1) |
0
Mars Express observations temporarily suspended
(PhysOrg.com) -- Anomalies in the operation of the solid-state mass memory system on board Mars Express have caused science observations to be temporarily halted. A technical work-around is being investigated ...
Space & Earth / Space Exploration
Nov 02, 2011 |
3 / 5 (1) |
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