Samsung Electronics announced today that it has begun producing the industry’s first four gigabit (Gb), low power double-data-rate 2 (LPDDR2) memory using 20 nanometer (nm) class technology. The mobile DRAM (dynamic ...
Electronics & Semiconductors
May 18, 2012
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(AP) -- Micron Technology Inc. has settled a lawsuit in which Oracle Corp. accused the Idaho memory chipmaker and other companies of artificially inflating prices for microchips.
Business
Mar 30, 2012
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(AP) -- Taiwan's government said Wednesday it would continue to push for the consolidation of the island's memory chip makers with Elpida Memory Inc., two days after the Japanese chipmaker filed for bankruptcy.
Electronics & Semiconductors
Feb 29, 2012
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(AP) -- Computer chipmaker Elpida Memory Inc. filed for Japan's largest manufacturing bankruptcy Monday after amassing debts from nose-diving prices, competition from Samsung and flooding in Thailand last year that stifled ...
Business
Feb 27, 2012
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South Korea's Hynix Semiconductor, the world's second-largest maker of memory chips, said Thursday it swung into the red in the fourth quarter as chip prices fell on weak demand for personal computers.
Business
Feb 2, 2012
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Elpida Memory, the third largest Dynamic Random Access Memory (DRAM) manufacturer in the world, today announced that it had developed the industry's first 4-gigabit next-generation mobile memory chips for smart phones, tablet ...
Electronics & Semiconductors
Nov 18, 2011
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Samsung Electronics, the world's largest memory chip maker, said Thursday it has begun mass production at a new line to raise production of flash memory chips used in tablets and smartphones.
Electronics & Semiconductors
Sep 22, 2011
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Imec and its 3D integration partners have proven the potential of 3D integration of a commercial DRAM chip on top of a logic IC for next-generation low-power mobile applications. Imec’s applied 3D EDA (electronic design ...
Electronics & Semiconductors
Jul 12, 2011
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In the frame of its research on future memory architectures, imec has made breakthroughs for both DRAM and RRAM memories. For DRAM, MIMcap (metal-insulator-metal capacitor) was established as a clear candidate for 1X DRAM ...
Electronics & Semiconductors
Jul 12, 2011
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Elpida Memory today announced that it has begun sample shipments of the industry's first DDR3 SDRAM (x32-bit I/O configuration) made using TSV (Through Silicon Via) stacking technology. The sample is a low-power 8-gigabit ...
Electronics & Semiconductors
Jun 28, 2011
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