News tagged with chip production
Toshiba announces chip to boost TransferJet
(PhysOrg.com) -- Toshiba earlier this week announced a wireless chip that can help carry TransferJet forward to wider use. The newly developed chip, "TC35420," is designed to support the TransferJet near-field wireless transmission ...
Sep 28, 2011 |
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Engineers revolutionize nano-device fabrication using amorphous metals
Yale engineers have created a process that may revolutionize the manufacture of nano-devices from computer memory to biomedical sensors by exploiting a novel type of metal. The material can be molded like plastics to create ...
Nanotechnology / Nanomaterials
Feb 11, 2009 |
4.4 / 5 (9) |
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Light-generating transistors to power labs on chips
(PhysOrg.com) -- What started out as 'blue-sky' thinking by a group of European researchers could ultimately lead to the commercial mass production of a new generation of optoelectronic components for devices ...
Dec 11, 2009 |
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Semiconductor sales down 28.6 pct in January: SIA
Worldwide semiconductor sales declined 28.6 percent in January from a year ago as the global recession continued to take a big bite out of the computer chip industry, an industry tracker said Monday.
Mar 02, 2009 |
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Japan's Renesas ups chip outsourcing to Taiwan giant
Japan's Renesas Electronics said Monday it will boost the outsourcing of its chip production to Taiwan's TSMC, but it declined comment on reports it would cut about 30 percent of its staff.
May 28, 2012 |
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Elpida develops next-generation mobile DRAM product
Elpida Memory, the third largest Dynamic Random Access Memory (DRAM) manufacturer in the world, today announced that it had developed the industry's first 4-gigabit next-generation mobile memory chips for ...
Nov 18, 2011 |
4.3 / 5 (7) |
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Elpida achieves 4-Layer 0.8mm mobile RAM package
Elpida Memory today announced that its researchers have developed the technology to mass manufacture a 0.8mm four-layer DRAM package, the thinnest memory device in the DRAM industry.
Jun 22, 2011 |
3 / 5 (1) |
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Next generation FeliCa contactless IC chip to be launched
Sony Corporation announces today the launch of the next generation FeliCa IC chip with enhanced security adopting the Advanced Encryption Standard (AES) encryption. The new IC chip will support AES as well ...
Jun 13, 2011 |
5 / 5 (1) |
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A power grid on a chip
Presented during the EPFL Middle East research days, a device only 4mm thick can manage an urban power grid a thousand times faster than currently possible.
Jun 09, 2011 |
4.6 / 5 (5) |
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Toshiba launches 19nm process NAND flash memory
(PhysOrg.com) -- Toshiba Corporation today announced that it has fabricated NAND flash memories with 19nm process technology, the finest level yet achieved. This latest technology advance has already been applied to 2-bit-per-cell ...
Apr 21, 2011 |
4.7 / 5 (6) |
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Toshiba launches 24nm process NAND flash memory
Toshiba Corp. has announced that it today started mass production of NAND flash memories fabricated with 24nm process technology.
Aug 31, 2010 |
5 / 5 (1) |
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Samsung Develops Advanced Packaging Technology to Achieve a 0.6mm-thick 8-chip Package
Samsung Electronics announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory ...
Nov 05, 2009 |
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Toshiba to launch 32nm process NAND flash memory
Toshiba Corporation today announced that it will start shipping NAND flash memory products fabricated with 32nm process technology. Samples of the world's first 32nm generation, 32-gigabit (Gb) single chips (4 gigabytes (GB)), ...
Apr 27, 2009 |
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Elpida starts sample shipments of next-generation mobile RAM products
Elpida Memory, the world's third largest Dynamic Random Access Memory manufacturer, today announced that it has begun sample shipments of 4-gigabit Wide IO Mobile RAMTM and 4-gigabit DDR3 Mobile RAM (LPDDR3).
Dec 29, 2011 |
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China urges factory safety after iPad plant blast
(AP) -- Beijing urged Foxconn Technology Group and other Taiwanese companies on Wednesday to ensure safety in their mainland China factories after a fatal blast at a facility that makes Apple iPads.
May 25, 2011 |
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