NXP announces world's smallest high-performance MOSFET

Feb 25, 2008

NXP Semiconductors, the independent company founded by Philips, today announced a new range of small signal MOSFET devices housed in one of the world’s smallest packages, the SOT883. Boasting an ultra-small 1.0 x 0.6 mm footprint, NXP’s SOT883 MOSFETs deliver power dissipation and performance comparable to SOT23, while occupying only 14 percent of the printed circuit board space.

Designed for use in a broad range of applications including DC/DC converter modules, power supplies for LCD TV and load switching for mobile phones and other portable devices, the SOT883 MOSFETs’ ultra-small footprint, extremely low 0.5 mm profile and best-in-class switching speed and very low Rds(on) enable manufacturers to meet consumer demand for more compact and power-efficient products.

“Market demands for smaller portable devices with increased battery life are driving the race to fit sophisticated functionality into smaller and smaller form factors,” said Dean Montano, product marketing manager, NXP Semiconductors. “Built on NXP’s proven Quad Flat Non-leaded technology, the SOT883 MOSFETs offer customers a power efficient and environmentally friendly package that still delivers the performance required by today’s cellular phone and mobile computing applications.”

In addition to dramatically reducing the MOSFETs’ footprint, NXP has eliminated the leads, which both frees up additional board space and improves thermal performance. This combination of superior thermal performance and Rds(on) values of less than 0.65 ohms at 2.5 V allows NXP’s newest MOSFETs to offer higher current carry capacity than currently available 1.0 x 0.6 mm MOSFETs. The new series also features best in class switching speed, with turn on times between 12-16 ns and turn-off times between 17-24 ns.

Manufactured using pure tin plating, high-efficiency packing techniques and green plastics that dispense with toxic flame retardants, the SOT883 MOSFET devices meet all environmental protection targets. The high packing density also fits 10,000 devices on a standard 180 mm reel, thus lowering assembly costs and inventory requirements.

The SOT883 is just one package offered by NXP in a portfolio of over 50 space-saving leadless packages with between two and 24 pins and dimensions ranging from 1.0 x 0.6 x 0.4 mm to 5.0 x 6.0 x 0.85 mm. These packages maximize the active silicon on the circuit board and minimize the use of raw materials to reduce costs. NXP offers the industry’s broadest portfolio of multimarket semiconductors in leadless packages.

Source: NXP

Explore further: Quick-change materials break the silicon speed limit for computers

add to favorites email to friend print save as pdf

Related Stories

Oculus unveils new prototype VR headset

22 hours ago

Oculus has unveiled a new prototype of its virtual reality headset. However, the VR company still isn't ready to release a consumer edition.

Final pieces to the circadian clock puzzle found

Sep 14, 2014

Researchers at the UNC School of Medicine have discovered how two genes – Period and Cryptochrome – keep the circadian clocks in all human cells in time and in proper rhythm with the 24-hour day, as well ...

Recommended for you

Oculus unveils new prototype VR headset

22 hours ago

Oculus has unveiled a new prototype of its virtual reality headset. However, the VR company still isn't ready to release a consumer edition.

Wireless sensor transmits tumor pressure

Sep 20, 2014

The interstitial pressure inside a tumor is often remarkably high compared to normal tissues and is thought to impede the delivery of chemotherapeutic agents as well as decrease the effectiveness of radiation ...

Tim Cook puts personal touch on iPhone 6 launch

Sep 20, 2014

Apple chief Tim Cook personally kicked off sales of the iPhone 6, joining in "selfies" and shaking hands with customers Friday outside the company's store near his Silicon Valley home.

Team improves solar-cell efficiency

Sep 19, 2014

New light has been shed on solar power generation using devices made with polymers, thanks to a collaboration between scientists in the University of Chicago's chemistry department, the Institute for Molecular ...

User comments : 0