Toshiba Corporation today announced that it has started sample shipments of a 64-gigabyte (GB) embedded NAND flash memory module, the first in the industry equipped with a UFS I/F. The module is fully compliant with the JEDEC UFS Ver.1.1 standard and is designed for application in a wide range of digital consumer products, including smartphones, tablet PCs.
Samples are mainly intended for evaluation of UFS I/F and its protocol in host chipsets and by OS vendors.
Demand continues to grow for large density, high-performance chips that support high resolution video, driven by improved data-processing speeds in host chipsets and wider bandwidths for wireless connectivity.
Toshiba has proved itself an innovator in this key area, and is now reinforcing its leadership by being first in the industry to support samples with a 64GB UFS module.
Toshiba will schedule mass-production and other densities in its line-up according to market demand.
Explore further: A bump circuit with flexible tuning ability that uses 500 times less power
More information: Part Number: THGLF0G9B8JBAIE