NXP introduces first 2-mm x 2-mm MOSFETs with tin-plated solderable side pads

Jun 15, 2012

NXP Semiconductors today introduced the industry’s first MOSFETs in a 2-mm x 2-mm low-profile DFN (discrete flat no-leads) package with tin-plated, solderable side pads. These unique side pads offer the advantage of optical soldering inspection, as well as a better quality of solder connection compared to conventional leadless packages.

Available immediately, the new PMPB11EN and PMPB20EN 30V N-Channel MOSFETs are the first of more than 20 devices housed in the DFN2020MD-6 (SOT1220) package from NXP. Both MOSFETs have a maximum drain current (ID) of >10 A, and very low Rds(on) values of 12 mOhm typ and 16.5 mOhm typ at 10V respectively for reduced conduction losses, which enable lower power consumption and longer battery life.

Only 0.6 mm in height, the new DFN2020 MOSFETs are also thinner than most 2-mm x 2-mm products on the market today, making them ideal for ultra-small load switches, power converters, and charger switches in portable applications such as smartphones and tablets. The MOSFETs are also well suited for other space-constrained applications including DC motors, server and network communications, as well as LED lighting, where power density and efficiency are critical.  Eight times smaller than standard SO8 packages, DFN2020 offers comparable thermal resistance, and can replace many larger MOSFET packages such as SO8, 3x3 or TSSOP8 with the same Rds(on) value range.

The new MOSFETs enhance NXP’s ultra-small leadless line-up which will include more than 60 types in 2-mm x 2-mm and 1-mm x 0.6-mm package sizes by the end of this year. is now a major player in low Rds(on) MOSFETs in very small sizes, offering both FET and bipolar transistor technologies.

Explore further: Renesas announces SRAM using leading-edge 16 nm FinFET for automotive information systems

More information: Further information on NXP’s new DFN2020 MOSFETs is available at www.nxp.com/ultra-small-mosfets

add to favorites email to friend print save as pdf

Related Stories

NXP announces world's smallest high-performance MOSFET

Feb 25, 2008

NXP Semiconductors, the independent company founded by Philips, today announced a new range of small signal MOSFET devices housed in one of the world’s smallest packages, the SOT883. Boasting an ultra-small 1.0 x 0.6 mm ...

Recommended for you

North Korea behind Sony hack, FBI says

3 hours ago

North Korea was responsible for a "destructive" cyber attack on Sony Pictures, the US Federal Bureau of Investigation said Friday, warning it would hunt down the perpetrators and make them pay.

Clooney slams skittish Hollywood after Sony hack

5 hours ago

Film star George Clooney slammed the Hollywood movie industry for failing to stand up against the cyber threats that prompted Sony Pictures to cancel release of the movie "The Interview."

The state of shale

6 hours ago

University of Pittsburgh researchers have shared their findings from three studies related to shale gas in a recent special issue of the journal Energy Technology, edited by Götz Veser, the Nickolas A. DeCecco Professor of Che ...

Coping with floods—of water and data

7 hours ago

Halloween 2013 brought real terror to an Austin, Texas, neighborhood, when a flash flood killed four residents and damaged roughly 1,200 homes. Following torrential rains, Onion Creek swept over its banks and inundated the ...

User comments : 0

Please sign in to add a comment. Registration is free, and takes less than a minute. Read more

Click here to reset your password.
Sign in to get notified via email when new comments are made.