CNSE develops innovative laser-enabled electronic packaging technology

Nov 18, 2011

(PhysOrg.com) -- Small. Fast. Precise. A new electronics manufacturing technology developed at NDSU’s Center for Nanoscale Science and Engineering eliminates challenges facing conventional packaging techniques and shows promise to significantly reduce the size and unit cost of microelectronic devices. The technology, called Laser-Enabled Advanced Packaging (LEAP), has the potential to enable high-volume handling, placement and interconnection of microelectronic components smaller than ever before possible.

CNSE researchers have successfully implemented the LEAP technology to fabricate the first-ever functional electronic device with a laser-assembled, ultra-thin silicon chip embedded in a flexible substrate. The research group is led by Val Marinov, associate professor of manufacturing engineering; and includes Orven Swenson, associate professor of physics at NDSU; graduate research assistants Ferdous Sarwar and Yuriy Atanasov; research engineer apprentice Ross Miller; Bernd Scholz, CNSE research engineer; and postdoctoral researcher Jingling Yan. Past participants in the research group include former CNSE research scientist Zhigang Chen, postdoctoral researcher Samali Datta, graduate research assistants Deyan Mihaylov and Sourin Bhattacharya, and undergraduate research assistant Matthew Semler.

The LEAP technology offers a new paradigm for numerous types of flexible and potentially disposable microelectronic devices, such as garment-integrated RFID tags, intelligent sensors platforms and self-adapting conformal antennas. “This technology has strong potential in the near future outside of defense applications to reduce the unit cost of high volume single-chip devices such as RFID tags, smart cards, chip-and-pin bank cards and ‘smart’ bank notes,” said Aaron Reinholz, associate director for electronics technology at CNSE.

A key part of LEAP is the patent-pending process, Thermo-Mechanical Selective Assisted Die Transfer (tmSLADT). This process selectively and rapidly places ultra-thin semiconductor chips at specific locations and orientations with high precision. According to the researchers, no other high-volume techniques currently exist for the selective placement of such ultra-thin, flexible components essential to fabricate electronic devices on flexible substrates, with various types of active and passive embedded components. “These types of components are especially of interest for flex substrate electronics, as they allow devices to bend, roll and be manipulated into complex geometries,” said Reinholz.

The LEAP technology is outlined in “Laser-Enabled Advanced Packaging of Ultrathin Bare Dice in Flexible Substrates” which has been accepted for publication by IEEE Transactions on Components, Packaging and , manuscript TCPMT-2011-105.

Explore further: "Fingerprinting" chips to fight counterfeiting

Related Stories

New concept for bendable packaged ultra-thin chips presented

Apr 04, 2006

IMEC and its associated laboratory INTEC of the University of Ghent jointly developed a new process flow for ultra-thin chip packages resulting in bendable packaged chips of only 50┬Ám thickness. The technology enables embedding ...

Recommended for you

Boxing match pops up on phones as TV habits change

9 hours ago

It should have been a proud moment for TV: drawing in millions of viewers willing to pay big money for a much-hyped sports event, while at the same time showing the clout traditional media still holds.

Engineering students create real-time 3-D radar system

10 hours ago

Spencer Kent stands nervously in front of Team D.R.A.D.I.S.' booth at Rice University's annual Engineering Design Showcase. Judging begins in about 10 minutes, and his teammate Galen Schmidt is frantically ...

Mozilla says HTTPS is the way forward for the Web

10 hours ago

The web developer community can hear a rallying cry loud and clear :Let's hear it for web security. Mozilla, the group behind the browser Firefox, is turning up the volume by saying enough's enough with non-secure ...

Facebook opens up Internet.org after neutrality flap

11 hours ago

Facebook said Monday it was opening up Internet.org, which provides connectivity to people in developing nations, to outside applications following a controversy over its limited set of online services.

User comments : 0

Please sign in to add a comment. Registration is free, and takes less than a minute. Read more

Click here to reset your password.
Sign in to get notified via email when new comments are made.