CNSE develops innovative laser-enabled electronic packaging technology

Nov 18, 2011

(PhysOrg.com) -- Small. Fast. Precise. A new electronics manufacturing technology developed at NDSU’s Center for Nanoscale Science and Engineering eliminates challenges facing conventional packaging techniques and shows promise to significantly reduce the size and unit cost of microelectronic devices. The technology, called Laser-Enabled Advanced Packaging (LEAP), has the potential to enable high-volume handling, placement and interconnection of microelectronic components smaller than ever before possible.

CNSE researchers have successfully implemented the LEAP technology to fabricate the first-ever functional electronic device with a laser-assembled, ultra-thin silicon chip embedded in a flexible substrate. The research group is led by Val Marinov, associate professor of manufacturing engineering; and includes Orven Swenson, associate professor of physics at NDSU; graduate research assistants Ferdous Sarwar and Yuriy Atanasov; research engineer apprentice Ross Miller; Bernd Scholz, CNSE research engineer; and postdoctoral researcher Jingling Yan. Past participants in the research group include former CNSE research scientist Zhigang Chen, postdoctoral researcher Samali Datta, graduate research assistants Deyan Mihaylov and Sourin Bhattacharya, and undergraduate research assistant Matthew Semler.

The LEAP technology offers a new paradigm for numerous types of flexible and potentially disposable microelectronic devices, such as garment-integrated RFID tags, intelligent sensors platforms and self-adapting conformal antennas. “This technology has strong potential in the near future outside of defense applications to reduce the unit cost of high volume single-chip devices such as RFID tags, smart cards, chip-and-pin bank cards and ‘smart’ bank notes,” said Aaron Reinholz, associate director for electronics technology at CNSE.

A key part of LEAP is the patent-pending process, Thermo-Mechanical Selective Assisted Die Transfer (tmSLADT). This process selectively and rapidly places ultra-thin semiconductor chips at specific locations and orientations with high precision. According to the researchers, no other high-volume techniques currently exist for the selective placement of such ultra-thin, flexible components essential to fabricate electronic devices on flexible substrates, with various types of active and passive embedded components. “These types of components are especially of interest for flex substrate electronics, as they allow devices to bend, roll and be manipulated into complex geometries,” said Reinholz.

The LEAP technology is outlined in “Laser-Enabled Advanced Packaging of Ultrathin Bare Dice in Flexible Substrates” which has been accepted for publication by IEEE Transactions on Components, Packaging and , manuscript TCPMT-2011-105.

Explore further: Renesas announces SRAM using leading-edge 16 nm FinFET for automotive information systems

Provided by North Dakota State University

5 /5 (2 votes)
add to favorites email to friend print save as pdf

Related Stories

New concept for bendable packaged ultra-thin chips presented

Apr 04, 2006

IMEC and its associated laboratory INTEC of the University of Ghent jointly developed a new process flow for ultra-thin chip packages resulting in bendable packaged chips of only 50µm thickness. The technology enables embedding ...

Recommended for you

Why the Sony hack isn't big news in Japan

8 hours ago

Japan's biggest newspaper, Yomiuri Shimbun, featured a story about Sony Corp. on its website Friday. It wasn't about hacking. It was about the company's struggling tablet business.

Off-world manufacturing is a go with space printer

11 hours ago

On Friday, the BBC reported on a NASA email exchange with a space station which involved astronauts on the International Space Station using their 3-D printer to make a wrench from instructions sent up in ...

Cadillac CT6 will get streaming video mirror

13 hours ago

Cadillac said Thursday it will add high resolution streaming video to the function of a rearview mirror, so that the driver's vision and safety can be enhanced. The technology will debut on the 2016 Cadillac ...

Sony faces 4th ex-employee lawsuit over hack

13 hours ago

A former director of technology for Sony Pictures Entertainment has sued the company over the data breach that resulted in the online posting of his private financial and personal information.

User comments : 0

Please sign in to add a comment. Registration is free, and takes less than a minute. Read more

Click here to reset your password.
Sign in to get notified via email when new comments are made.