Intel ships world's smallest HSPA+ solution for 3G smart phones

Feb 14, 2011

Intel Mobile Communications today announced shipment of its XMM 6260 platform to key customers. Optimized for smart phone architectures coupled with an application processor or as a standalone solution for PC modems and data cards, the advanced HSPA+ platform is based on the X-GOLD 626 baseband processor and the SMARTi UE2 RF transceiver. Combined with the 3GPP Release 7 protocol stack, the XMM 6260 platform comprises a fully integrated HSPA+ system solution supporting HSPA category 14 (21Mbps) in the downlink and category 7 (11.5Mbps) in the uplink.

"With shipping of the XMM 6260 platform ahead of schedule we continue the fast evolution of our leading baseband and transceiver technology by adding advanced + features," said Prof. Dr. Hermann Eul, president of Intel Mobile Communications. "The fourth generation of successful 3G platforms underlines our technology leadership and our customers benefit from lower cost and space savings, which significantly increase design flexibility to create unique and feature-rich handsets and mobile Internet cards with innovative form factors."

The XMM 6260 platform is based on the X-GOLD 626 baseband processor, manufactured by TSMC in leading-edge 40nm process technology. The X-GOLD 626 integrates a power management unit, enabling world-class in both active and idle mode. The processor is combined with the SMARTi UE2 RF transceiver. Leveraging from a power-saving 65nm CMOS technology the transceiver uses a unique digital architecture that significantly reduces the number of power amplifiers and RF components, resulting in reduced board space and power consumption. The XMM 6260 smart phone modem platform enables HSPA+ designs in less than 600mm2 PCB (Printed Circuit Board) area, making them among the smallest comparable solutions worldwide.

The common and scalable ARM11-based processor architecture used across all 2G and 3G platforms ensures Intel Mobile Communications customers a high degree of reuse of their hardware and software investment when developing handsets across the entire cellular portfolio. In addition, the includes numerous advanced 3GPP Release 7 features such as receive diversity, interference cancellation and CPC (Continuous Packet Connectivity) that significantly improve power consumption and system performance.

The XMM 6260 is available in volume and will be presented at the Intel booth (Hall 1, Booth B22) during the Mobile World Congress in Barcelona from Feb. 14-17. Worldwide shipment to key customers has already started and design-in of the XMM 6260 is supported by a complete reference design.

Explore further: Quick-change materials break the silicon speed limit for computers

add to favorites email to friend print save as pdf

Related Stories

Infineon, Motorola to Develop 3G Radio Frequency Chip

Sep 25, 2007

Infineon Technologies AG today announced that it has signed an agreement with Motorola to develop a new multi-mode, single-chip 3G radio frequency (RF) transceiver based on Infineon’s SMARTi UE chip.

Recommended for you

Samsung may launch first Tizen phone in India

1 hour ago

Samsung Electronics Co., which faces a slowdown in emerging market smartphone sales, will release its long-delayed Tizen-powered handset in India before the end of this year, a report said Monday.

Microsoft delays launch of Xbox in China

3 hours ago

Microsoft, which was due to launch the Xbox One in China on Tuesday, has said it will put back the "historic" event to later this year, slowing what was billed as the first game console to enter the market ...

User comments : 0