Samsung Electronics Develops Wafer Level Package for Higher Chip Performance

July 5, 2004

Samsung Electronics Co., Ltd., the world leader in advanced semiconductor memory technology, recently announced the industry's first wafer level package (WLP) for high-performance 512Megabit (Mb) DDR2 SDRAMs. WLP, unlike conventional package technology, builds the package layer directly on the wafer by incorporating fabrication process. This new approach enhances the electrical properties and reduces the physical space making WLP an optimal package solution for mobile environments and high-density memory modules.

The new package technology, WLP, is originated from the wafer level process. Two patterned inter-layer dielectrics (ILD), with insulating characteristics, and a metal layer replaces the conventional package substrate. Ball grids give the appearance of a chip scale package (CSP) that is truly scaled down to the actual die size.

The compact new package enhances electrical properties though shorter circuit-routing, reduces package size to die level and package process time, and brings higher productivity, especially to larger wafer sizes, with higher throughput and lower cost. The WLP also enhances environment protection measures as eliminating the conventional package removes need to acquire and treat the package or its remains making WLP a competitive choice over conventional packages.

Samsung’s WLP supports the JEDEC specifications for DDR2 CSP. Without further modification the DDR2 WLP can easily replace the CSP form allowing system designers to facilitate the introduction of WLP for DDR2 SDRAM applications.

The original press release can be found here.

Explore further: Casio and Renesas Technology to Collaborate on Semiconductor Device Packaging Technology

Related Stories

Monolithic ultrasonic integrated circuits

November 20, 2013

Ultrasonography based on traditional bulk piezoelectric transducers has been established as an inexpensive and safe medical imaging modality. By borrowing techniques from the microelectronics industry, the performance of ...

Recommended for you

Self-sealing syringe prevents blood loss in hemophilic mice

October 28, 2016

(—For people whose blood does not clot appropriately, such as those with hemophilia, diabetes, or cancer, getting an injection or blood draw with a hypodermic needle is not a trivial matter. Because the needle ...

Closer look reveals tubule structure of endoplasmic reticulum

October 28, 2016

(—A team of researchers from the U.S. and the U.K. has used high-resolution imaging techniques to get a closer look at the endoplasmic reticulum (ET), a cellular organelle, and in so doing, has found that its structure ...

Novel light sources made of 2-D materials

October 28, 2016

Physicists from the University of Würzburg have designed a light source that emits photon pairs, which are particularly well suited for tap-proof data encryption. The experiment's key ingredients: a semiconductor crystal ...

How planets like Jupiter form

October 28, 2016

Young giant planets are born from gas and dust. Researchers of ETH Zürich and the Universities of Zürich and Bern simulated different scenarios relying on the computing power of the Swiss National Supercomputing Centre ...


Please sign in to add a comment. Registration is free, and takes less than a minute. Read more

Click here to reset your password.
Sign in to get notified via email when new comments are made.