STATS Introduces Silicon Based System-in-Package Solution

May 28, 2004

ST Assembly Test Services Ltd (STATS) developed a new technology, called chip scale module package (CSMP), which involves the fabrication of passive devices such as resistors, capacitors, inductors, filters, baluns and interconnects directly onto a silicon substrate.

CSMP is an advanced system-in-package approach which features a unique modular architecture to integrate mixed IC technologies and a wide variety of passives directly onto a silicon substrate. CSMP enables analog and digital functions to be independently optimized and combined for a distinct performance and cost advantage over system-on-chip implementations. The result is a high-performance system level solution which provides a significant reduction in die size, weight, number of interconnections, and system board space requirements.

STATS will offer the CSMP technology as a full turnkey service, providing fully characterized design libraries of resistors, capacitors, inductors, filters, and baluns. The design library will include electrical models that enable designers to simulate CSMP circuits in their chip design tools to ensure first pass success in the customer's applications.

The electrical models can be delivered as touchstone files for engineers using linear frequency-domain simulators or equivalent electrical models for non-linear and time-domain simulators. Initial parts libraries cover the dc-6GHz frequencies, with filters and baluns designed for the 2.45 and 5.6GHz 802.11 bands, addressing WLAN, cellular handset, Bluetooth, and other wireless markets.

The CSMP platform provides customers with additional external interconnect flexibility, offering both wire bond and flip chip options. Although CSMP is generally customized, STATS has qualified two package versions: CSMP-stPBGA, which is wire bonded onto a small thin plastic ball grid array (stPBGA) platform, and a flip chip solution mounted onto a land grid array (LGA) platform. Other package family extensions such as quad leadless package (also referred to in the industry as flat-pack, no lead) and quad flat pack (QFP) are currently planned.

Related Stories

Recommended for you

A quantum of light for materials science

December 1, 2015

Computer simulations that predict the light-induced change in the physical and chemical properties of complex systems, molecules, nanostructures and solids usually ignore the quantum nature of light. Scientists of the Max-Planck ...

Exiled exoplanet likely kicked out of star's neighborhood

December 1, 2015

A planet discovered last year sitting at an unusually large distance from its star - 16 times farther than Pluto is from the sun - may have been kicked out of its birthplace close to the star in a process similar to what ...


Please sign in to add a comment. Registration is free, and takes less than a minute. Read more

Click here to reset your password.
Sign in to get notified via email when new comments are made.